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X28HC64
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
E
H
0.25(0.010) M
B M
M28.3 (JEDEC MS-013-AE ISSUE C )
28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
-B-
A
0.0926
0.1043
2.35
2.65
-
1
2
3
L
A1
B
0.0040
0.013
0.0118
0.0200
0.10
0.33
0.30
0.51
-
9
SEATING PLANE
C
0.0091
0.0125
0.23
0.32
-
-A-
D
A
h x 45 o
D
E
0.6969
0.2914
0.7125
0.2992
17.70
7.40
18.10
7.60
3
4
e
B
0.25(0.010) M
-C-
C A M
B S
A1
α
0.10(0.004)
C
e
H
h
L
N
0.05 BSC
0.394 0.419
0.01 0.029
0.016 0.050
28
1.27 BSC
10.00 10.65
0.25 0.75
0.40 1.27
28
-
-
5
6
7
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2
α
0 o
8 o
0 o
8 o
-
Rev. 0 12/93
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
16
FN8109.2
August 28, 2009
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